Manufacturing Process Information
The module is moisture sensitive (MSL 3). The module must be mounted and reflowed within 168 hours (floor life out of bag). If floor life out of bag time is exceeded and baking is required, refer to IPC/JEDEC J-STD-033 for bake procedure.
Reflow soldering is recommended. A maximum number of 3 reflow passes are allowed. The reflow information is provided for reference only. Users should optimize their own board level parameters to get the desired reflow outcome.
Removing and replacing with the same part is not recommended.
Replace with a new part.
|
Profile Feature |
Lead free Assembly |
|---|---|
|
Ramp-to-Peak profile average ramp-up rate |
0.7°C to 1.3°C |
|
Liquidous Temperature |
221°C (SAC 305 Solder Alloy) |
|
Time above liquidous |
45 s to 75 s |
|
Peak package body temperature |
241°C ±4°C |
All components on the module are sealed and the module can withstand an aqueous wash process. The module is assembled using Alpha CVP-390 no-clean solder paste and wash solvents used should be compatible. Users should optimize and verify their own wash process to ensure module performance is not negatively affected.
The module and its components must not be disturbed when in reflow, doing so may damage the module. If the module is removed, replacing with a new module is recommended.